Monday, 20 May 2013


QUANTUM ELECTRONICS --- SILICON PHOTONIC IC TECHNOLOGY


The hybrid silicon platform is growing fast as there is rising demand in complex circuit’s production and with loads of integrated components including on-chip lasers. It is theoretically proven that this platform is well positioned and holds great potential to address future needs for medium-scale photonic integrated circuits.




Photonic integration is basically the technology that allows the combination of different optical components, such as lasers, modulators, and photo detectors, on a single photonic chip.


The concept of medium- and large-scale integration, with large components on a single chip, is a major driver for research on silicon photonics in the silicon-on-insulator (SOI) platform. The SOI fabrication infrastructure is compatible with the mature and high-quality CMOS technology, which is robust and reproducible and has high yield. It is possible to make PICs in the SOI platform on large 200mm-diameter wafers, and this allows for low cost and high volumes. Since these PICs can operate at wavelengths of 1.3 and 1.55μm, prime application candidates are telecommunication and interconnect.

Ziyad Alamri
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